详细说明:
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FEATURES
●End stackable for standard 0.1" integrated circuit pitch.
●Molded 0.3" integrated circuit packing outline allowing automatic insertion.
●Smaller size makes better heat convection during PC board reflow wave soldering.
●Top tape sealed to withstand wave soldering, board washing.
●All plastics are UL 94V-0 grade fire retardant.
●Twin contacts designed to ensure stable contact.
●Gold plated contact to ensure low contact resistance and Tin plated terminal to prevent
contamination during soldering.
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